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    Your present location:Media >> Events >> Thermal Management: The Basics of Heat Transfer

    Thermal Management: The Basics of Heat Transfer

    Number of visits: Date:2019-12-24 12:28

    Thermal Management centers around the movement and removal of heat from a system, often in electronics. This includes heat spreading, heat transfer, and heat dissipation.


    Heat Spreading

    Heat spreaders offer cost-effective, reliable high thermal conductivity and efficacy with almost no moving parts.


    A heat spreader is an effective solution for dealing with heat sources that have a high heat-flux density (high heat flow per unit area) and where the secondary heat exchanger in itself is not an effective method of dispersing heat (due to space limitations, energy use, cost, etc.). Heat spreaders can allow designers to use an air-cooled, rather than liquid-cooled, secondary heat exchanger.


    Most heat spreaders are copper or aluminum plates that function as heat exchangers. Heat spreaders transfer heat between its source and (generally) a secondary heat exchanger. The heat "spreads” from the heat source through the heat spreader, thus moving from a smaller to a larger cross sectional area (the secondary heat exchanger). While the heat flow is the same in the heat spreader as in the secondary heat exchanger, the heat flux density is reduced, making it easier to dissipate the heat via air cooling. The lower heat flux density also allows the secondary heat exchanger to be made of less expensive materials.


    Heat Transfer

    Moving heat by remote heat dissipation with passive devices like heat pipes or loop heat pipes provides an efficient thermal solution with high performance, low weight, low cost and high reliability – there are no moving parts to fail, wear out, replace or lubricate.


    Heat pipes can be used to move heat over distances ranges from a few inches (>50mm) to greater than 3 feet (> 1 meter). In a heat pipe, heat from a heat source enters the evaporator end of the heat pipe, causing the working fluid to change phase from liquid to vapor. The vapor travels through the vapor space within the heat pipe to the other end, the condenser end, where a heat sink or other secondary heat dissipation device removes the heat energy. The release of heat in the condenser end causes the vapor to condense back to liquid which is absorbed into a capillary wick structure. The capillary wick structures incorporated into the internal walls of a heat pipe allow the liquid condensate inside the heat pipe to return from the condenser section of the heat pipe to the evaporator section via capillary action.


    The heat-moving efficiency of this thermal solution is determined by factors such as wick, working fluid, diameter, length, bending, flattening and orientation.


    Dissipating Heat to Air

    In many applications, the preferred method of thermal management is convection cooling to air, especially in electronics cooling applications. With Aavid’s heat sink, heat pipe assemblies, and heat spreader technologies, waste heat is typically absorbed from a heat generating device (e.g., an electrical component within an electronics system — i.e. computers and data centers) and then moved or spread for dissipation into the ambient air through either natural or forced (using a fan air mover).


    Dissipating Heat to Liquid

    Applications with large heat loads such as military radars or power electronics often require waste heat to be dissipated into the liquid coolants (water, water/glycol, PAO) of a secondary system for ultimate heat dissipation.


    Heat Dissipation


    Fans are the general device for heat dissipation, install it on the heat pipe or heat spreaders,it will takes heats efficiency.

    TypeInfo: Events

    Keywords for the information:thermal paste for heat transfer